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two-phase flow, thin-film approximation, particle removal, immersed boundary method
MAS 2011
Simulations of liquid film flows with free surface on rotating silicon wafers (RoWaFlowSim)
Markus Junk, Frank Holsteyns, Felix Staudegger, Christiane Lechner, Hendrik Kuhlmann, Doris Prieling, Helfried Steiner, Bernhard Gschaider, Petr Vita
For application in the semi-conductor industries, the flow on a rotating disk (wafer) is studied numerically. A systematic validation of available variations of the Volume-of-Fluid (VoF) scheme for this two-phase flow problem is done. To make larger parameter variations of this problem with a moving fluid supply possible, a code based on the thin-film approximation is developed. To better understand possible physical mechanisms for the removal of nano-particulate contaminations from a wafer, another code to study the detachment of submicron particles exposed to shear flows is developed and validated. An immersed boundary method with direct forcing is implemented. The particle-wall interaction is treated with a soft contact model.
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